RRP Electronics Ltd Launched Semiconductor Manufacturing Facility By CIOTechOutlook Team

RRP Electronics Ltd Launched Semiconductor Manufacturing Facility

CIOTechOutlook Team | Monday, 23 September 2024, 05:25 IST

RRP Electronics Ltd is thrilled to announce the opening of Maharashtra's first OSAT (Outsourced Semiconductor Assembly and Test)/ATMP (Assembly, Testing, Marking, and Packaging) semiconductor production plant in Navi Mumbai, which marks a significant milestone in India's semiconductor mission.

The inauguration was conducted by Eknath Shinde, Maharashtra's Chief Minister; Devendra Fadnavis, Deputy Chief Minister; and Ajit Pawar, Deputy Chief Minister of Finance. The event was also attended by Uday Samant, Minister of Industries; Dr Harshdeep Kamble, Principal Secretary of Industries, Government of Maharashtra; Sachin Tendulkar, Bharat Ratna awardee and renowned cricketer; and Dr Anil Kakodkar, Padma Vibhushan awardee and former Chairman of the Department of Atomic Energy.

This facility, backed by a strong technological relationship with HMT Microelectronic AG and its top companions, was designed to transform the semiconductor landscape. It was designed to support advanced packaging technologies such as QFN, BGA, SoC, and mixed ASICs.

In its initial phase, the plant could generate 10,000 wafers each month. Future objectives included establishing a dedicated design house, expanding into LiDAR technology research to meet the increased demand for automotive power chips, and producing TFT and WATN components for automotive applications.

HMT Microelectronic AG and Renowa Vision Inc signed a Memorandum of Understanding. The MoU with HMT represented initiatives involving QFN, BGA, ASICs, and later development into LiDAR technology. The Memorandum of Understanding with Renowa represented a key step forward in RRP's expansion trajectory, allowing the purchase of technology for OSAT and FAB for NAND memory chips. These are non-volatile storage solutions that don't need power to keep data.