Samsung To Invest $280 Million into Chip Packaging Research Facility By CIOTechOutlook Team

Samsung To Invest $280 Million into Chip Packaging Research Facility

CIOTechOutlook Team | Thursday, 21 December 2023, 07:02 IST

As per city announcement, Samsung Electronics of South Korea would invest roughly 40 billion yen ($280 million) over five years in a center for advanced chip packaging research in Japan.

Samsung was looking at establishing a packaging facility in Kanagawa prefecture, where it already has a research and development centre, to deepen ties with Japanese makers of chipmaking equipment and materials, as per reuters

Japan's industry ministry announced that it would provide Samsung with subsidies worth up to 20 billion yen in order to help revitalize domestic chip manufacturing. Samsung's investment comes at a time when tensions between South Korea and Japan are lessening, as the US encourages allies to collaborate to challenge China's expanding technological supremacy.

Last year, the chipmaker began expanding its sophisticated chip packaging section. Companies are competing to create new packaging techniques that combine components in a single package to increase overall chip performance.

The Japanese facility will enable Samsung to improve its semiconductor leadership and collaborate with packaging-related companies situated in Yokohama, according to the city's announcement.

The Samsung Group is a South Korean multinational industrial corporation based in Suwon, South Korea. It is the largest South Korean chaebol, consisting of multiple related enterprises, the majority of which are combined under the Samsung name. Samsung has the ninth greatest worldwide brand value as of 2020.