Softbank and NewPhotonics Team up For Advanced Photonics Technology By CIOTechOutlook Team

Softbank and NewPhotonics Team up For Advanced Photonics Technology

CIOTechOutlook Team | Wednesday, 25 September 2024, 02:31 IST

SoftBank Corp. and NewPhotonics LTD, a top provider in advanced integrated photonics, revealed a partnership for collaborative research and development to enhance photonics technologies for LPO, CPO, and All-Optics Switch Fabric. This technology, which combines photonics and electronics and includes high-speed optical communication and Optical Switching Technology, enables AI data centers and mobile fronthaul infrastructure to have low latency and low power consumption.

NewPhotonics' patented technologies, along with its photonics integrated chip (PIC), help SoftBank in AI data center and mobile fronthaul infrastructure by providing dependable all-optics communication and optical fabric switching.

Improving performance of GPU/CPU/switch fabric by utilizing PIC and low latency optical connectivity, the technology will also tackle power consumption and capacity bottlenecks in AI cluster workloads through high-speed optical communication and optical switching technology.

Co-packaged advanced optical technologies are being used to enhance speed and energy efficiency in data center re-designs aimed at high performance compute and vector processing applications. Furthermore, by integrating the NewPhotonics PIC into the optical transceiver, the LPO technology allows for longer distance transmission than current LPO technology. Implementing NewPhotonics LPO technology in mobile fronthaul is anticipated to decrease processing latencies, lower power usage, and increase data transport equipment ranges